PRODUCT

Plating Surface Treatment
Aluminum Surface Treatment
Chemical
Customer Service
FEATURE
01

Plating Surface Treatment

Feature of The Plating Section

One of the most remarkable features of ALMEX TECHNOLOGIES’s plating equipment is that machine, chemical process and computer control system are always developed in sync with each other to form a comprehensive system.

We founded the surface treatment lab in Utsunomiya Factory that has implemented a unique development system in the surface treatment to realize a total service for customers.

Feature of The Plating Section

Vertical Continuous Plating(VCP)

Vertical Continuous Plating(VCP)

Plating equipment (Cu) with full-automatic carrier for printed wiring board.

Feature

  • 1.Various device compositions according to different product specifications.
  • 2.Anti-pollution technology without actuators on the tank.
  • 3.Quality improvement by submerged regular jet system and precision filter etc.
  • 4.Simple configuration for anode supply, checkup and maintenance.

Option

Automatic Removal Equipment

• Board grip width: 10mm from the upper side of board
• Correspondence board thickness: 0.06 - 2.2mm
• Correspondence board size: W340-510xH400-620mm

Wash and dry conveyor equipment

• Correspondence board thickness: 0.06 - 2.2 mm
• Correspondence board size: W340-510xH400-620mm
• With automatic receipt machine

Plating Carrier Equipment

Plating Carrier Equipment

Plating equipment (Cu, Ni, Sn-Pb, etc) with full-automatic carrier for printed wiring board.

Feature

  • 1.High accuracy for hoisting and stopping.

Option

  • 1.Stock Yard
  • 2.Automatic Loading System
  • 3.Automatic Unloading System
  • 4.Automatic throw Device, Automatic Receiving Device